Comparison ledger
Axcelis 200 ACU, Trion Apollo, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | ApolloTrion |
|---|---|---|
| OEM | Axcelis | Trion |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Trion Apollo |
| Specifications | ||
| Configuration | Parts Machine[1] | — |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | — |
| Tool type | Asher[1] | — |
| Wafer size | 200mm[3] | 100mm to 300mm[5] |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| Etch rate (photoresist strip) | — | up to 6 µm/min[5] |
| Plasma source options | — | Inductively Coupled Plasma (ICP) or SST-Lightning microwave[6] |
| RF bias | — | Yes (RIE biased electrode)[7] |
| Tuning | — | Self-tuning / automatic tuning[5] |
| Chuck type | — | Electrostatic chuck with helium backside cooling[7] |
| Wafer handling robot | — | Multi-axis atmospheric robot; transports 150mm, 200mm, and 300mm wafers[7] |
| Process controller | — | PC-based with graphical software; recipes stored on 3.5" disks[7] |
| Physical dimensions (W x D x H) | — | 18" x 50" x 51"[7] |
| Maximum wafer size (stated in source) | — | up to 8" (200mm) — note: source also states robot handles 300mm wafers[7] |
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