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Comparison ledger

17099370 Outer strike plateversusGSD 200

Axcelis 17099370 Outer strike plate, Axcelis GSD 200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
GSD 200Axcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size—In Air Wafer Handling:
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis 17099370 Outer strike plateAxcelis GSD 200
Specifications
ConfigurationUsed with Axcelis GSD 200[1]MER[3]
ManufacturerAxcelis[2]—
Model17099370 Outer strike plate[1]—
Part numberOEM number 17099370[2]—
Used withAxcelis GSD 200[1]—
ConditionNEW[2]—
Source Head—Enhanced Source w/ Tantalum[3]
Extraction—90 kV / 90 kV[3]
Source Analyzer—Triple Indexed Mass Analysis Magnet & Power Supply[3]
RGA Resolver—Port[3]
RGA Chamber—Port[3]
HYT—Particle Detection Monitor[3]
Charge Control—E-Shwr IV (Fwd Bias) / P/N: 1183280[3]
Post Accel Elect—P/N: 1182480[3]
Flag Faraday—Standard[3]
SMIF—ASYST ARM 2200[3]
Compressor—9600 & 8200[3]
GeF 4 (High Pressure)—Unit MFC[3]
PH 3—(SDS): Unit MFC[3]
XE—Unit MFC ( E Shower not use)[3]
Argon (High Pressure)—Unit MFC[3]
Wafer Size—6 inch (150 mm)[3]
Extraction Voltage—90 kV / 90 kV[3]
Implant Angle—Two-axis variable (+ / - degrees in both axes)[3]
Disk Drive Type—Rotary[3]
Cell Controller—Cell 133[3]
Operating System—Sun OS[3]
Protocols—SECS-I & SECS II[3]
Interface—GM Interface & Ethernet Port[3]
Wafer size—In Air Wafer Handling:[3]
Dose Controller—Real Time Patented Dose Control[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]Equipment inventory listing