Waferpedia

Comparison ledger

A 412 LPCVDversus1000 Hot Plate

ASM A 412 LPCVD, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMASMCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM A 412 LPCVDCEE 1000 Hot Plate
Cited variants—
Specifications
ConfigurationNITR[1]4"[4]
OEMASM[1]—
ModelA 412[1]—
Tool typeLPCVD furnace (Low Pressure Chemical Vapor Deposition)[1]—
Wafer size12 inch[1]—
Vintage2006[1]—
Equipment typeLPCVD Furnace (Low Pressure Chemical Vapor Deposition)[1]—
Type—Hot Plate[4]
Wafer Size—4 inch[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing