Comparison ledger
Applied Materials Mirra 3400, SUSS MicroTec PA 300 Control, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra 3400Applied Materials | PA 300 ControlSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1998 Vintage · 2001 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra | SUSS MicroTec PA 300 |
| Cited variants |
| — |
| Specifications | ||
| Cassette Que | 4 Wet[3] | — |
| Handling | Wet In / Wet Out[3] | — |
| Platens | 3[3] | — |
| Polish Heads | 4[3] | — |
| Slurry Delivery | Rotary pump (6)[3] | — |
| Slurry Configuration | AB, AB w/ Position Sensor[3] | — |
| Slurry Delivery Arm Type | Extended w/ 4 Outputs[3] | — |
| ISRM P 1 | iScan / Full Scan/M. Torque[3] | — |
| ISRM P 2 | Full Scan/M. Torque[3] | — |
| ISRM P 3 | Full Scan/M. Torque[3] | — |
| UPA | IT / RR / MEM[3] | — |
| UPA Supply | Nitrogen Gas[3] | — |
| Head Types | Titan I[3] | — |
| Pad Conditioner | DDF 3[3] | — |
| Min / Max Platen Speed | 0 -125 rpm[3] | — |
| Min / Max Slurry Flow | 15 - 400 ml/mn[3] | — |
| Min / Max Head pressure | 0.7 - 14 psi[3] | — |
| Min / Max PC Downforce | 3.0 - 17 lbf[3] | — |
| Endpoint Software | IB 11 J 1[3] | — |
| Polisher Software | mp 2 B 6.2_36[3] | — |
| Wafer sizes | 150 mm, 200 mm (6 inch, 8 inch)[3] | — |
| Number of platens | 3[3] | — |
| Number of polish heads | 4[3] | — |
| Head type | Titan I[3] | — |
| Platen speed range | 0 – 125 rpm[3] | — |
| Slurry flow rate range | 15 – 400 ml/min[3] | — |
| Head pressure range | 0.7 – 14 psi[3] | — |
| PC downforce range | 3.0 – 17 lbf[3] | — |
| Handling type | Wet In / Wet Out[3] | — |
| Operating system | Windows NT 4.00.1381 or above[2] | — |
| Electrical requirements | 200/208 VAC, 200 A, 45 kVA[4] | — |
| Endpoint software version | IB 11 J 1[3] | — |
| Polisher software version | mp 2 B 6.2_36[3] | — |
| Number of polishing heads | 4[3] | — |
| Min/Max slurry flow | 15 - 400 ml/min[3] | — |
| Polisher software | mp 2 B 6.2_36 / MB60a1 or above[3] | — |
| Line voltage | 200/208 VAC[2] | — |
| Line frequency | 50 Hz[2] | — |
| Circuit breaker rating | 200 A[2] | — |
| SECS/GEM interface | Yes[2] | — |
| Hard drive configuration | Dual hard disk, XP / 68 pin SCSI[3] | — |
| Memory | 128 MB or above[2] | — |
| CPU | Pentium III or above[2] | — |
| Manufacturer | Applied Materials[3] | — |
| Model | Mirra 3400[3] | — |
| Category | CMP[5] | CMP[1] |
| Wafer size | 200 mm[2] | — |
| Version | 200 mm[2] | — |
| Vintage | 1998[5] | — |
| Configuration | Stand-Alone Oxide/STI CMP[2] | 500 VA, 115V, 60Hz[6] |
| Power | — | 500 VA, 115V, 60Hz[6] |
| Wafer handling | — | 12" Nickel Plated Aluminum Chuck[6] |
| Control & software | — | ATT M300 Temp Control Unit[1] |
| Optics | — | 10X, 2X Mitutoyo Plan Apo Objective, 2ea[6] |
| Configuration & options | — | Cascade CMPS-888 Microscope; Suss PH150 Micropositioner, 4ea[6] |
| Chuck | — | 12-inch nickel plated aluminum chuck[6] |
| Control unit | — | ATT M300 Temp Control Unit[1] |
| Microscope | — | Cascade CMPS-888 Microscope[6] |
| Micropositioners | — | Suss PH150 Micropositioner, 4ea[6] |