Comparison ledger
Applied Materials Mirra 3400, Lam Research IPEC AvantGaard 776, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra 3400Applied Materials | IPEC AvantGaard 776Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1998 Vintage · 2001 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra | Lam Research IPEC |
| Cited variants |
| |
| Specifications | ||
| Cassette Que | 4 Wet[5] | — |
| Handling | Wet In / Wet Out[5] | — |
| Platens | 3[5] | — |
| Polish Heads | 4[5] | — |
| Slurry Delivery | Rotary pump (6)[5] | — |
| Slurry Configuration | AB, AB w/ Position Sensor[5] | — |
| Slurry Delivery Arm Type | Extended w/ 4 Outputs[5] | — |
| ISRM P 1 | iScan / Full Scan/M. Torque[5] | — |
| ISRM P 2 | Full Scan/M. Torque[5] | — |
| ISRM P 3 | Full Scan/M. Torque[5] | — |
| UPA | IT / RR / MEM[5] | — |
| UPA Supply | Nitrogen Gas[5] | — |
| Head Types | Titan I[5] | — |
| Pad Conditioner | DDF 3[5] | — |
| Min / Max Platen Speed | 0 -125 rpm[5] | — |
| Min / Max Slurry Flow | 15 - 400 ml/mn[5] | — |
| Min / Max Head pressure | 0.7 - 14 psi[5] | — |
| Min / Max PC Downforce | 3.0 - 17 lbf[5] | — |
| Endpoint Software | IB 11 J 1[5] | — |
| Polisher Software | mp 2 B 6.2_36[5] | — |
| Wafer sizes | 150 mm, 200 mm (6 inch, 8 inch)[5] | — |
| Number of platens | 3[5] | — |
| Number of polish heads | 4[5] | — |
| Head type | Titan I[5] | — |
| Platen speed range | 0 – 125 rpm[5] | — |
| Slurry flow rate range | 15 – 400 ml/min[5] | — |
| Head pressure range | 0.7 – 14 psi[5] | — |
| PC downforce range | 3.0 – 17 lbf[5] | — |
| Handling type | Wet In / Wet Out[5] | — |
| Operating system | Windows NT 4.00.1381 or above[2] | — |
| Electrical requirements | 200/208 VAC, 200 A, 45 kVA[6] | — |
| Endpoint software version | IB 11 J 1[5] | — |
| Polisher software version | mp 2 B 6.2_36[5] | — |
| Number of polishing heads | 4[5] | — |
| Min/Max slurry flow | 15 - 400 ml/min[5] | — |
| Polisher software | mp 2 B 6.2_36 / MB60a1 or above[5] | — |
| Line voltage | 200/208 VAC[2] | — |
| Line frequency | 50 Hz[2] | — |
| Circuit breaker rating | 200 A[2] | — |
| SECS/GEM interface | Yes[2] | — |
| Hard drive configuration | Dual hard disk, XP / 68 pin SCSI[5] | — |
| Memory | 128 MB or above[2] | — |
| CPU | Pentium III or above[2] | — |
| Manufacturer | Applied Materials[5] | — |
| Model | Mirra 3400[5] | AvantGaard 776[4] |
| Category | CMP[7] | CMP[4] |
| Wafer size | 200 mm[2] | 8 inch[3] |
| Version | 200 mm[2] | — |
| Vintage | 1998[7] | — |
| Configuration | Stand-Alone Oxide/STI CMP[2] | Dielectric[1] |
| Make | — | Lam / IPEC[3] |
| Wafer size (version) | — | 200 mm[8] |
| Process | — | Tungsten[3] |
| Asset description | — | CMP system for spares use[8] |