Waferpedia

Comparison ledger

Centura AP DPS AdvantEdge G 2 Metalversus1512e

Applied Materials Centura AP DPS AdvantEdge G 2 Metal, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura AP DPS AdvantEdge G 2 MetalTegal 1512e
Cited variants
  • Centura AP DPS AdvantEdge G2 Poly[1]
—
Specifications
Wafer Size12 inch (300 mm)[2]—
PlatformCentura[2]—
TechnologyDPS[2]—
Process TypeMetal Etch[2]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]asseta.comasseta.com
  2. [2]Equipment inventory listing
  3. [3]semistarcorp.comsemistarcorp.com