Waferpedia

Comparison ledger

2300 Exelan Flex Exversus200 ACU

Applied Materials 2300 Exelan Flex Ex, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2300 Exelan Flex ExApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 2300 Exelan Flex ExAxcelis NV GSD 200
Specifications
Configuration—Parts Machine[1]
Manufacturer—Axcelis[1]
Model—200 ACU[1]
Tool type—Asher[1]
Wafer size—200mm[3]
Serial number—AU6A356AH[3]
Computer system—M 200 PC, M 200[4]
Part number—SC 4572 A[4]
Volts—208[4]
Amps—30[4]
Equipment type—Asher[1]
Wafer configuration—8 inch[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com