Waferpedia

Comparison ledger

0041-39086 ESC PartversusGigaBatch

Applied Materials 0041-39086 ESC Part, PVA TePla GigaBatch, side by side. Every value shown is drawn from the cited encyclopedia entries.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
GigaBatchPVA TePla
OEMApplied MaterialsPVA TePla
CategoryEtchEtch
Wafer size—75 mm to 100 mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—PVA TePla GigaBatch
Cited variants—
  • GIGAbatch 360[1]
  • GIGAbatch 380M[1]
Specifications
Plasma type—High frequency plasma[2]
Plasma frequency—2.45 GHz[2]
Plasma power—200 to 600 W[2]
Gas—O2[2]
O2 maximum flow—1000 ml/min[2]
Primary vacuum chamber—Quartz primary vacuum chamber[2]
Primary vacuum chamber dimensions—D int. 245 mm x Prof. 380 mm[2]
Wafer capacity—25 wafers[2]
Wafer size range—75 mm to 100 mm[2]
Plasma power range—200 to 600 W[2]
Process gas—O₂ (max flow 1000 ml/min)[2]
Chamber material—Quartz[2]
Chamber inner diameter—245 mm[2]
Chamber depth—380 mm[2]
Supported wafer sizes—75 mm to 100 mm[2]
Uniformity—20% to 30% depending on process time[2]
Positive resist etch rate (high power)—250 nm/min to 1.2 µm/min[2]
Positive resist etch rate (low power)—100 nm/min to 500 nm/min[2]
Vacuum chamber material—Quartz[2]
Chamber diameter—245 mm (GIGAbatch 360); 300 mm (GIGAbatch 380M)[1]
Wafer batch size—Up to 25 wafers per run (75-100 mm)[2]
Substrate handling—2" to 8" wafers (GIGAbatch 360/380M)[1]
Dimensions (w/h/d)—Approx. 795 x 1540 x 710 mm[1]
Weight—190 kg[1]
Power range—200 to 600 W[2]
Chamber dimensions (internal)—Diameter 245 mm, Depth 380 mm[2]
Process pressure—0.5 to 0.8 mbar[2]
Chamber—Quartz primary vacuum chamber, D int. 245 mm x Prof. 380 mm[2]
Process time (High Power)—1 min to 30 min (PR_Strip_High_xx)[2]
Process time (Low Power)—10 sec to 15 min (PR_Strip_Low_xx)[2]
Gas flow—Maximum 1000 ml/min[2]
Holder capacity—25 wafers[2]
Wafer size—75 mm to 100 mm[2]
0041-39086 ESC Part entryGigaBatch entryAsk about these tools →Share experience with this comparison →

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]pvatepla.compvatepla.com
  2. [2]epfl.chepfl.ch