Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa IConn ProCu Plus LA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | IConn ProCu Plus LAKulicke & Soffa |
|---|---|---|
| OEM | Applied Materials | Kulicke & Soffa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Kulicke & Soffa IConn |
| Specifications | ||
| Configuration | — | for Parts[1] |
| Type | — | Fully automatic wire bonder[2] |
| Purpose | — | Make the electric connexion between the chip and the substratum with a gold or a copper wire[2] |
| Typical product | — | Typical ultra-fine pitch ball grid array product[2] |
| Minimum pad pitch | — | 35 µm[2] |
| Accuracy | — | 2 µm @ 3 sigma[2] |
| Minimum wire diameter | — | 0.6 mils[2] |
| Bond area | — | 56 mm x 87 mm[2] |
| Wire options | — | Copper wire option with forming gas[2] |
| Advanced node capability | — | Advanced node wafers down to 28 nm or below[2] |
| Process development/control | — | Wire pull and ball shear available[2] |
| Alternate wire option | — | Option de soudure de fil coincé sous capillaire (capillary wedge, wedge-to-wedge) with aluminum or gold wire[3] |
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