Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi DS 9000 E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | DS 9000 EBesi |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi DS 9000 E |
| Specifications | ||
| Voltage | — | 208 VAC[1] |
| Configuration | — | Single Phase[2] |
| Phase | — | 1 Phase[3] |
| Make | — | Besi / Datacon[2] |
| Model | — | DS 9000 E[2] |
| Tool type | — | Bonder[2] |
| Wafer size | — | 8 inch[2] |
| Frequency | — | 50/60 Hz[1] |
| Current | — | 10 Amps[1] |
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