Waferpedia

Comparison ledger

0020 23839 PartversusBJD 1800 Thermal

Applied Materials 0020 23839 Part, Temescal BJD 1800 Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartTemescal BJD 1800
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]External power suppy integrated into unit to improve the deposition to less than 1A/s (2025)[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing