Waferpedia

Comparison ledger

0020 23839 PartversusPlasmalab 133

Applied Materials 0020 23839 Part, Oxford Instruments Plasmalab 133, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
Plasmalab 133Oxford Instruments
OEMApplied MaterialsOxford Instruments
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartOxford Instruments Plasmalab
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]—
Frequency—50 Hz[2]
Voltage—415 Vac 3[3]
Process type—PECVD (Plasma-Enhanced Chemical Vapor Deposition)[2]
Category—Deposition[2]
Vintage—2010[3]
Wafer size—8"[4]
Maximum wafer size—300 mm (330 mm chuck)[5]
RF power—600 W, 13.56 MHz[5]
Electrode temperature control—10 °C – 80 °C (water-cooled)[5]
Endpoint detection—Verity Optical Emission Spectroscopy (OES), 200–800 nm[5]
Gas delivery—8-line manifold with 7 MFCs[5]
Power—50 Hz[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]asseta.comasseta.com
  5. [5]instrumenthive.cominstrumenthive.com