Waferpedia

Comparison ledger

0020 17485 Partversus2400

Applied Materials 0020 17485 Part, Perkin Elmer 2400, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
2400Perkin Elmer
OEMApplied MaterialsPerkin Elmer
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartPerkin Elmer 2400
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]Cryopump included[2]
Type—Sputtering tool[2]
Cathodes—2 round cathodes[3]
MFC—1 MFC[3]
Vacuum level—2-10 millitorr[3]
Control system—New programmable HMI / PLC system[3]
Cryopump—Rebuilt CTI 8 cryopump with compressor and lines[3]
Mechanical pump—Rebuilt dual stage mechanical pump[3]
Electronics—New electronics[3]
Cryopump included—Cryopump included[2]
Dry pump—No dry pump[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing