Waferpedia

Comparison ledger

0010 47763versusCentura eMax Nitride

Applied Materials 0010 47763, Applied Materials Centura eMax Nitride, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Centura eMax NitrideApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Applied Materials Centura
Specifications
Configuration2nd Source New[1]2 Chamber Emax[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Gas—CF4, CH2F2, CHF3, Ar, O2, N2[4]
OS—AMAT Legacy[4]
Buffer Robot—HP[4]
Chiller 1—AMAT Endura HX 18706-01[4]
Chiller 2—Thermo Electron HX 150 106178026[4]
Wafer size—8 inch[4]
Chamber configuration—2 Chamber Emax; 1 Orienter/degas[4]
Gas chemistry—CF4, CH2F2, CHF3, Ar, O2, N2[4]
Operating system—AMAT Legacy[4]
Chamber #A—eMAX[4]
Chamber #B—eMAX[4]
Chamber #C—EMPTY[4]
Chamber #D—EMPTY[4]
Chamber #E—EMPTY[4]
Chamber #F—Orienter[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing