Comparison ledger
Applied Materials 0010 47763, Applied Materials Centura DPS 2 Poly Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Centura DPS 2 Poly DryApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials Centura DPS |
| Specifications | ||
| Configuration | 2nd Source New[1] | 300mm DPS Metal chamber with 200mm ESC[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Mainframe | — | 300mm[4] |
| Gas | — | O2, CHF3, Ar, CF4, O2/He, He, N2, HBr, CL2, NF3[4] |
| OS | — | Windows NT[4] |
| Missing | — | 23.11.08 1 LL off line[4] |
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