Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual Heatedversus353637 E 90

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, West Bond 353637 E 90, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
353637 E 90West Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedWest Bond 353637 E 90
Specifications
ConfigurationRefurbished[1]2400B Series software[2]
Bonding Area—5.375" × 9.5" (5 3/8" × 9 1/2")[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing