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0010-47763 ASSY ESC Bonded Monopolar Dual Heatedversus850 LT SOI Fusion Wafer

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, EV Group 850 LT SOI Fusion Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials
850 LT SOI Fusion WaferEV Group
OEMApplied MaterialsEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size—200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedEV Group 850
Specifications
ConfigurationRefurbished[1]Fully-Automatic[2]
Wafer size—Suitable for wafer sizes up to 8"/200mm wafers[2]
0010-47763 ASSY ESC Bonded Monopolar Dual Heated entry850 LT SOI Fusion Wafer entryAsk about these tools →Share experience with this comparison →

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing