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0010-22161 High EFF RF MatchversusNXT II Placement

Applied Materials 0010-22161 High EFF RF Match, Fuji NXT II Placement, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsFuji
Category——
Wafer size——
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Introduced——
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FamilyApplied Materials 0010-22161 High EFF RF MatchFuji NXT II Placement
Cited variants—
Specifications
MakeApplied Materials[2]Fuji[4]
Model0010-22161[2]NXT II[4]
DescriptionHTESC PH 1 REV A[3]—
ConditionUsed[3]—
Stock NumberBM6628[3]—
Vintage—2013[4]
Inventory ID—140603-001[5]
Fuji serial number—665[5]
Hours—17,166[5]
Base—4M Base with (2) M6II Modules H01 Heads Installed Dual Lane Independent Base[5]
Feeder capacity—M3II - Up to 20 types (8 mm tape); M6II - Up to 45 types (8 mm tape)[5]
PCB size—Double conveyor: 48 x 48 mm to 534 x 510 mm; single conveyor: 48 x 48 mm to 534 x 610 mm[1]
PCB load time—Double conveyor: continuous 0 sec; single conveyor: 2.5 sec (M3II only); single conveyor: 3.4 sec (M6II only)[5]
Placing accuracy—Chips: ±0.05 mm (3 sigma); four side leaded: 0.03 mm (3 sigma)[5]
Throughput—H12HS: 22,500 CPH; H08: 10,500 CPH; H04: 6,500 CPH; H02: 5,600 CPH; H01: 4,200 CPH[5]
Applicable components—H12HS: 0402 (01005) to 7.5 x 7.5 mm, max height 3.0 mm; H08: 0402 (01005) to 12 x 12 mm, max height 6.5 mm; H04: 1608 (0603) to 38 x 38 mm, max height 9.5 mm; H02/H01: 1608 (0603) to 74 x 74 mm (32 mm x 180 mm), max height 25.4 mm[5]
Module width—M3II - 320 mm; M6II - 645 mm[5]
Machine dimensions—4MII base: L 1390 mm x W 1934 mm x H 1474 mm; 2MII base: L 740 mm x W 1934 mm x H 1474 mm[5]
Sources (6)Every fact above is drawn from these public sources
  1. [1]utd-machinery.comutd-machinery.com
  2. [2]Equipment inventory listing
  3. [3]tarasemi.comtarasemi.com
  4. [4]Equipment inventory listing
  5. [5]ibe-surplus.comibe-surplus.com
  6. [6]efsmt.comefsmt.com