Waferpedia

Comparison ledger

0010-21246 PartversusU 4 Proto

Applied Materials 0010-21246 Part, LPKF U 4 Proto, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
OEMApplied MaterialsLPKF
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—LPKF U 4 Proto
Specifications
Laser class—1[1]
Max material size (X x Y x Z)—229 mm x 305 mm x 10 mm (9" x 12" x 0.4")[1]
Laser wavelength—355 nm[1]
Laser pulse frequency—25 kHz – 300 kHz[1]
Structuring speed—200 mm/s (7.8"/s) on 18 μm / ½ oz Cu on FR4[1]
Cutting speed—200 mm/s (7.8"/s) for 0.5 mm (0.02") FR4*[1]
Diameter of focused laser beam—20 μm[1]
Minimum line / space—50 μm/20 μm (2 mil/0.8 mil), on laminated substrate (18 μm Cu)[1]
Accuracy—± 1.98 μm (± 0.08 mil) mechanical resolution scanfield[1]
Dimensions (W x H x D)—910 mm x 1650 mm x 795 mm (35.8" x 65" x 31.3"); height with open door 1765 mm (69.5")[1]
Weight—340 kg[1]
Electrical consumption—110 V – 230 V; 1.4 kW[1]
Required compressed air supply—Min. 6 bar (87 psi), min. 230 l/min (8.12 cfm)[1]
Laser source power—up to 6 W[2]
Calibration—better than 10 μm across 9" x 12" working area/vacuum table[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]lpkfusa.comlpkfusa.com
  2. [2]tjr-lab.mit.edutjr-lab.mit.edu