Waferpedia

Comparison ledger

0010-21246 PartversusMxP+ Poly

Applied Materials 0010-21246 Part, Applied Materials MxP+ Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
MxP+ PolyApplied Materials
OEMApplied MaterialsApplied Materials
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Applied Materials MxP+ Poly
Cited variants—
  • Applied Materials P5000 MxP+ Poly[1]
Specifications
Wafer Size—200mm[2]
Platform—Centura 5200[2]
Process Type—Polysilicon Etch[2]
Date of Manufacture—1998[2]
Software Version—4.9_15[2]
Orienter Quantity—1[2]
MxP Poly Quantity—1[2]
MxP+ Poly Quantity—2[2]
eMxP+ ESC Quantity—1[2]
End Point Detection—Monochromator[2]
Gases Used—NF3, CH3F, CL2, HBR, CHF3, AR, CF4, O2, N2, C4F8, CO, HE/O2[2]
MFCs—32 Digital MFC's[2]
Robot—HP Robot[2]
Dry Pumps—4-IQDP80, 2-IQDP80/WSU151[2]
Chillers—5-Neslab-150[2]
Wafer Size (Asseta)—6"[1]
ESC Type—Polymide[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]asseta.comasseta.com
  2. [2]macquarie.commacquarie.com