Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Tescan S8000X, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | S8000XTescan |
|---|---|---|
| OEM | Applied Materials | Tescan |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Tescan S8000X |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | — |
| Instrument type | — | Plasma-source focused ion beam microscope and high-resolution BrightBeam scanning electron microscope[2] |
| Ion source | — | Xe+ ion plasma source[2] |
| Focused beam current | — | Up to 1 uA[2] |
| Milling rate | — | Up to 50X faster than prior Ga+ ion technology[2] |
| Electron microscope optics | — | Field-free, ultra-high resolution optics with improved low-energy imaging[2] |
| Analytical capability | — | Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)[2] |
| Cryogenic capability | — | Cryogenic stage and sample transfer loadlock allowing work down to -160 C or introduction of frozen samples[2] |
| Nanomanipulator | — | Cryogenic Kleindiek nanomanipulator for in-situ interaction and lift-out of frozen sections for subsequent TEM analysis[2] |
| Ion source type | — | Xe+ ion plasma source[2] |
| Maximum focused beam current | — | 1 uA[2] |
| Electron source type | — | BrightBeam SEM, field-free, ultra-high resolution[2] |
| Analytical capabilities | — | ToF-SIMS and EDS[2] |
| Cryogenic stage temperature range | — | down to -160 C[2] |
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