Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusMultiplex ICP Advanced Oxide

Applied Materials 0010-16392 ESC Assembly, STS Multiplex ICP Advanced Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
OEMApplied MaterialsSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblySTS Multiplex ICP
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Voltage—208 V[3]
Configuration—80 A[3]
Frequency—60 Hz[3]
RF Generators—ENI ACG10B 1kW (13.56MHz)[3]
Clamp Type—Standard WTC[3]
Platen Type—Domed[3]
Turbo Pump—None[3]
MACs Robot—None[3]
Pumping System—None[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing