Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusRIE790

Applied Materials 0010-16392 ESC Assembly, Plasma-Therm RIE790, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
RIE790Plasma-Therm
OEMApplied MaterialsPlasma-Therm
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyPlasma-Therm RIE790
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]RIE790[3]
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Manufacturer—PlasmaTherm[3]
Process type—Reactive ion etch (RIE)[3]
Reactor type—Parallel plate[3]
Chemistries—SF6, CHF3, CF4, O2, Ar[3]
Etch targets—Semiconductors, dielectrics, metals[3]
Restriction—None[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]cores.research.asu.educores.research.asu.edu