Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal CV-6SXL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | CV-6SXLTemescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | 5" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal CV-6SXL |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | CV-6SXL[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Manufacturer | — | Temescal[2] |
| Description | — | Electron-Beam Evaporation System[2] |
| Power supply | — | 10 kV[2] |
| E-beam source | — | 4-pocket Series 260 E-Beam turret source[2] |
| Controller | — | TemEbeam Controller (EBC)[2] |
| Deposition controller | — | Inficon IC/5 Thin Film Deposition Controller[2] |
| Vacuum system | — | Cryo-pumped system with low E-7 ultimate base pressure[2] |
| Automatic vacuum sequencing | — | CHA Auto-Tech II[2] |
| Thickness monitoring | — | Crystal thickness monitoring[2] |
| Sample size | — | Up to 5" diameter non-heated; 4" diameter heated[2] |
| Heated sample holder | — | Programmable; sample temps up to 370°C[2] |
| Oxygen gas MFC | — | For maintaining oxide stoichiometry[2] |
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