Waferpedia

Comparison ledger

0010-13622 RF Match forversusHiPace300

Applied Materials 0010-13622 RF Match for, Pfeiffer HiPace300, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
HiPace300Pfeiffer
OEMApplied MaterialsPfeiffer
CategoryDepositionDeposition
Wafer size—100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forPfeiffer HiPace300
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]—
Model0010-13622[1]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Pump type—Turbo pump[2]
Application context—Loadlock secondary pump in the EVA 451 evaporator system[2]
Manufacturer—Pfeiffer[2]
Model designation—HiPace300[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]epfl.chepfl.ch