Comparison ledger
Applied Materials 0010-13622 RF Match for, Perkin Elmer PE 4400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | PE 4400Perkin Elmer |
|---|---|---|
| OEM | Applied Materials | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Perkin Elmer PE 4400 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Not operational[2] |
| Model | 0010-13622[1] | PE 4400[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Make | — | Perkin Elmer[2] |
| Equipment type | — | Sputtering System[2] |
| Category | — | Deposition[3] |
| Cathode shape | — | Circular[4] |
| Cathode size | — | 8 inch[4] |
| Cathode port amount | — | 1 to 4[4] |
| Cathode / sputter type | — | RF Magnetron[4] |
| DC power supply | — | 1-5 KW[4] |
| RF power supply | — | 1-2 KW[4] |
| Process gas | — | Argon (200 SCCM) standard[4] |
| Gas lines | — | Up to 3 gas lines, MFC customized[4] |
| Substrate size | — | Small to 6 inch[4] |
| Wafer load | — | Manually load, capable of limited automatic operation[4] |
| Throughput per batch | — | 3 inch wafer, 30 pieces; 4 inch wafer, 13 pieces; 5 inch wafer, 9 pieces; 6 inch wafer, 7 pieces[4] |
| Sputter rate | — | 20 to 500 Angstroms/kw-min depending on model, cathode, process, sputter material, etc.[4] |
| Uniformity capacity | — | ±7%~10%[4] |
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