Comparison ledger
Applied Materials 0010-13622 RF Match for, Denton Vacuum Thermal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | ThermalDenton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Denton Vacuum Thermal |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Diffusion Pump[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Pump type | — | Diffusion Pump, Roughing Pump[2] |
| Deposition sources | — | Four sources: two for boats and two for wire materials[3] |
| Sample rotation control | — | Equipped[3] |
| Number of metals deposited sequentially (max) | — | 4[3] |
| E-beam source (as related model) | — | 4-pocket electron beam evaporation source[4] |
| Substrate size (related model) | — | Handles up to one 4" diameter substrate[4] |
Plan your fab
Building a Deposition process? Get a complete equipment list.
Open the fab equipment planner →