Waferpedia

Comparison ledger

0010-03485 Magnet AssyversusU 4 Proto

Applied Materials 0010-03485 Magnet Assy, LPKF U 4 Proto, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03485 Magnet AssyApplied Materials
OEMApplied MaterialsLPKF
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-03485 Magnet AssyLPKF U 4 Proto
Specifications
ConfigurationWP AL 300mm PVD[1]—
OEMApplied Materials[1]—
Model0010-03485[1]—
DescriptionMAGNET ASSY, WP AL 300MM PVD[2]—
ProcessPVD[3]—
Wafer size300mm[4]—
VersionSpares[4]—
Part Number0010-03485[1]—
ManufacturerApplied Materials[1]—
Process TypePVD (Physical Vapor Deposition)[1]—
Application (Material)Aluminum (AL)[1]—
Wafer Diameter (associated)300 mm[1]—
Laser class—1[5]
Max material size (X x Y x Z)—229 mm x 305 mm x 10 mm (9" x 12" x 0.4")[5]
Laser wavelength—355 nm[5]
Laser pulse frequency—25 kHz – 300 kHz[5]
Structuring speed—200 mm/s (7.8"/s) on 18 μm / ½ oz Cu on FR4[5]
Cutting speed—200 mm/s (7.8"/s) for 0.5 mm (0.02") FR4*[5]
Diameter of focused laser beam—20 μm[5]
Minimum line / space—50 μm/20 μm (2 mil/0.8 mil), on laminated substrate (18 μm Cu)[5]
Accuracy—± 1.98 μm (± 0.08 mil) mechanical resolution scanfield[5]
Dimensions (W x H x D)—910 mm x 1650 mm x 795 mm (35.8" x 65" x 31.3"); height with open door 1765 mm (69.5")[5]
Weight—340 kg[5]
Electrical consumption—110 V – 230 V; 1.4 kW[5]
Required compressed air supply—Min. 6 bar (87 psi), min. 230 l/min (8.12 cfm)[5]
Laser source power—up to 6 W[6]
Calibration—better than 10 μm across 9" x 12" working area/vacuum table[6]
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]layla-ec.comlayla-ec.com
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]lpkfusa.comlpkfusa.com
  6. [6]tjr-lab.mit.edutjr-lab.mit.edu