Waferpedia

Comparison ledger

F 5112 E-Beam Lithographyversus1000 Family

Advantest F 5112 E-Beam Lithography, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
OEMAdvantestUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAdvantest F 5112 E-Beam LithographyUltratech 1000 Family
Specifications
Accelaration voltage50 kV[1]—
Field size1600 μm x800 μm[1]—
Beam current3.5 μA[1]—
Beam size4 μm x4 μm variable shaped beam[1]—
Scanning speed8 MHz[1]—
Stitching accuracy45 nm[1]—
Overlay accuracy45 nm[1]—
Configuration50/60 Hz[2]—
Acceleration voltage50 kV[1]—
Wafer size3 inch[1]—
Minimum feature size100 nm[3]—
CD variation3 sigma <= 15 nm[3]—
Exposure methodBlock exposure[3]—
Maximum number of block patterns70[3]—
Power frequency50/60 Hz[2]—
ModelF 5112[1]—
Max. no. of block patterns70[3]—
Tool type—Photolithography step-and-repeat 1X stepper[4]
Optical design—Wynne Dyson[4]
Magnification—1X[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]en.wikipedia.orgen.wikipedia.org