Waferpedia

Comparison ledger

W-GM-4200 Wafer Edgeversus20 36 Surface

Accretech W-GM-4200 Wafer Edge, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMAccretechBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size150mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech W-GM-4200 Wafer EdgeBlanchard 20 36 Surface
Specifications
VoltageAC200V +-5% 3ø[1]—
Power Consumption5.0 KVA[1]—
Main Air Source0,56Mpa[1]—
Spindle Air Source0,56Mpa[1]—
Grinding and Cleanig Water15L/min, 0.3Mpa, 18°C recommended[1]—
Mist Exhaust5m3/min[1]—
Wafer size150mm, 200mm[1]—
Wafer Thickness0,4-1,0mm[1]—
Wafer typeWafer with OF or notch[1]—
Notch Angle89deg – 95deg[1]—
Notch Angle Setting Value0,001deg step[1]—
Grinding UnitLeft/Right[1]—
Grinding wheelFor Periphery and for Notch[1]—
Periphery Grinding wheel speed2500m/min (wheel 200mm, at 4000rpm)[1]—
ConfigurationRotational Frequency of Spindle for Notch: 70000-94000rpm[1]With new Elecro-Matic Neutrol II Magnetic Chuck Control[2]
Driving System for Peripheral GrindingBuilt-in by inverter motor[1]—
Driving System for Notch GrindingAir bearing system[1]—
Magnetic Chuck Control—Electro-Matic Neutrol II[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing