Waferpedia

Comparison ledger

UF 3000 EXversusOpus 3

Accretech UF 3000 EX, Semics Opus 3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Test & Probe, null[1]
Side-by-side comparison of selected equipment models
Attribute
UF 3000 EXAccretech
Opus 3Semics
OEMAccretechSemics
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system—MS Windows XP Professional
Generation——
FamilyAccretech UF 3000Semics Opus
Specifications
ConfigurationAuto-tilt Option[1]15 A[4]
HFMHF 9000 EX[1]—
Aard HolderNobinite[1]—
Card ExchangeAPC[1]—
Temp50℃~150℃[1]—
Cleaning Unit250 x 155 (notched)[1]—
Tester I/FGPIB[1]—
CPUAdvme 7509[1]—
Wafer Size12 inch[3]—
Auto-tilt OptionIncluded[1]—
Tri-TempIncluded[1]—
Chuck Temperature Range50℃~150℃[1]—
Compatible Tester ModelsIP 750 EX-HD[1]—
Card Holder MaterialNobinite[1]—
Tester InterfaceGPIB[1]—
Prober TypeProber[1]—
Wafer Sizes12 inch[3]8 inch, 12 inch[6]
Auto-tilt optionYes[1]—
No ChillerYes[1]—
Vintage2007[1]2014, 2015, 2016, 2017 (observed units)[4]
Power Supply—200-240 V[4]
Full Load Current—11 A[4]
Max Ampere Rating—25 A[7]
Interruption Capacity—10 kA[7]
Power Supply Voltage—200-240 V[4]
Power Supply Current—15 A[4]
Power Supply Frequency—50/60 Hz[4]
Hot Chuck—Included[6]
Communication Interface—GPIB[6]
Operating System—MS Windows XP Professional[6]
Type—Prober[4]
Communication—GBIP[6]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]inventory listing