Comparison ledger
Accretech UF 300 A Automatic Wafer, Tokyo Electron Precio XL, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 300 A Automatic WaferAccretech | Precio XLTokyo Electron |
|---|---|---|
| OEM | Accretech | Tokyo Electron |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2001 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 300 | Tokyo Electron Precio |
| Specifications | ||
| Configuration | Nickel chuck[2] | Single Open with Open Loader[1] |
| Phase | 1 Phase[2] | — |
| Cognex board type | 8200[3] | — |
| Voltage | 208V[3] | — |
| OEM | Accretech / TSK[2] | — |
| Model | UF 300 A[2] | Precio XL[4] |
| Equipment type | Automatic Wafer Prober[2] | Production Wafer Prober[6] |
| Wafer size | 8 inch[2] | 200 mm, 300 mm[4] |
| Chuck | Nickel chuck[2] | — |
| Power | 1 Phase[2] | — |
| Vintage | 2001[2] | — |
| Keyboard/joystick | Keyboard, joystick[3] | — |
| Storage | 3.5" floppy disk / 3.5" hard disk[3] | — |
| Printer | Internal printer[3] | — |
| Interfaces | GPIB I/F, RS232 I/F, Ethernet I/[3] | — |
| Functions | Probe mark inspection; automatic probe to pad alignment; multi-die probing up to 256 DUTs; multi function cleaning pad; automatic needle height alignment; soak time option; new E2 camera update[3] | Focus OCR; hot chuck function 50~150 deg; WAPP function; 93K DD interface; flip SACC function; GPIB[1] |
| Chuck Type | Nickel chuck (some units) or gold plated chuck (other units)[3] | — |
| Automation | Fully automatic[3] | — |
| Probe Card Change | Included[3] | — |
| User Interface | Keyboard, joystick, 3.5" floppy disk / hard disk, internal printer[3] | — |
| Vision System | Cognex board type 8200, New E2 camera update[3] | — |
| Probing Features | Multi-die probing up to 256 DUTs, automatic probe to pad alignment, probe mark inspection, automatic needle height alignment[3] | — |
| Cleaning | Multi function cleaning pad[3] | — |
| Soak Option | Soak time option[3] | — |
| Hot Chuck Function | — | 50~150 deg[1] |
| Manufacturer | — | Tokyo Electron Limited[4] |
| Type | — | Automatic wafer prober[5] |
| Accuracy | — | 1.8 µm[4] |
| Z accuracy | — | 5 µm[4] |
| Probing force | — | 200 kg, 300 kg[4] |
| Stage type | — | Linear Motor[4] |
| Category | — | Test & Probe[6] |
| Main features | — | TELPADS-I, Auto Leveling, CoSMOz[5] |
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