Waferpedia

Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF3000versusEDC-650

Accretech , Tokyo Semitsu Kogaku (TSK) UF3000, Laurell EDC-650, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
EDC-650Laurell
OEMAccretechLaurell
Category——
Wafer sizeWafer Equipment100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF3000Laurell EDC-650
Specifications
Wafer sizeWafer Equipment[1]—
Currently Configured for300mm[1]—
With ChillerSCU-600B[1]—
Section 1Tool General Information[1]—
Section 2Tool Specific Information[1]—
ManufacturerAccretech, Tokyo Semitsu Kogaku (TSK)[1]—
ModelUF3000[1]EDC-650[4]
CategoryWafer Equipment[1]—
Equipment typeWafer Prober[1]—
Tool statusIn production[1]—
Tool locationCleanroom[1]—
ChillerSCU-600B[1]—
Vendor tool serial numberF24006MZ[1]—
Micron MISTI/LID numberFE3SKAA300(TMM)[1]—
Year2004[2]—
Quantity9[3]—
Short descriptionFully Automated Prober[3]—
Version300 mm[3]—
Nickel chuck12 inch[3]—
Front loading300 mm single FOUP loading[3]—
Robot bladeDual ceramic robot blade[3]—
Software versionS5.0FC4[3]—
Loader typeTSK[3]—
Chuck temperature range30~150℃[3]—
OCR camera typeType6[3]—
Auto card changeYes[3]—
Needle cleaning unit150 mm x 150 mm ceramics pad[3]—
ManipulatorHinge, MHF4000[3]—
Test system interfaceAL6050 & Focus3000[3]—
IncludesPrinter[3]—
Equipment name in source—Laurell EDC-650 Spin Processor #2 (Primary Litho)[4]
Wafer handling—Unclamped pieces (mounted on carrier wafer), 100 mm round wafers, 150 mm round wafers, 100 mm × 100 mm square wafers[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]wotol.comwotol.com
  3. [3]wotol.comwotol.com
  4. [4]confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca