Waferpedia

Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF200versusEDC-650

Accretech , Tokyo Semitsu Kogaku (TSK) UF200, Laurell EDC-650, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
EDC-650Laurell
OEMAccretechLaurell
Category——
Wafer sizeWafer Equipment100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF200Laurell EDC-650
Specifications
Wafer sizeWafer Equipment[1]—
Date of Manufacture1998[1]—
Currently Configured for200mm[1]—
Current Equipment StatusAvailable[1]—
Available dateCurrently Available[1]—
Equipment categoryProduction Wafer Prober[1]—
Model—EDC-650[2]
Equipment name in source—Laurell EDC-650 Spin Processor #2 (Primary Litho)[2]
Wafer handling—Unclamped pieces (mounted on carrier wafer), 100 mm round wafers, 150 mm round wafers, 100 mm × 100 mm square wafers[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca