Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, KLA Surfscan SP 1 DLS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | |
|---|---|---|
| OEM | Accretech | KLA |
| Category | — | — |
| Wafer size | Wafer Equipment | For Wafer Centering Device |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | KLA Surfscan |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | For Wafer Centering Device[2] |
| Date of Manufacture | 1998[1] | — |
| Currently Configured for | 200mm[1] | — |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| Configuration | — | Upgraded/New[2] |
| Defect Sensitivity (Polished Bare Silicon) | — | 0.050 µm[3] |
| Laser Source | — | Argon Ion Laser (488 nm)[3] |
| Wafer Size Support | — | 200 mm and 300 mm[3] |
| Enhanced Rough Film Sensitivity | — | Yes[3] |
| Real Time Defect Classification (RTDC) | — | Yes[3] |
| Defect Map and Histogram with Zoom | — | Yes[3] |
| Map to Map | — | Yes[3] |
| Operator Interface | — | Yes[3] |
| Blower Unit | — | Yes[3] |
| OEM | — | KLA-Tencor[3] |
| Model | — | SP1 DLS[4] |
| Wafer Size | — | 200/300mm[3] |
| Defect Sensitivity | — | 0.050um on polished bare silicon[3] |
| Surface Type | — | Unpatterned[3] |
| Key Feature | — | Enhanced Rough Film Sensitivity[3] |
| Optional Handler | — | 300mm Single FOUP/FIMS Handler[3] |