Comparison ledger
Accretech HRG 200 X, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HRG 200 XAccretech | 321Disco |
|---|---|---|
| OEM | Accretech | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech HRG 200 | Disco 321 |
| Specifications | ||
| Grinding Wheel Diameter | 250 mm[1] | — |
| Grinding Wheel Spindle Speed | Max. 3600 rmp[1] | — |
| Working Spindle Speed | 800 rpm[1] | — |
| Motor Power | 6.3 KW[1] | — |
| Wafer Sizes | 2, 3, 4, 5, 6, 8 inch[1] | — |
| Wafer Size Range | 2-inch to 8-inch wafers[2] | — |
| Machine Type | Fully Automatic High Rigid 2-Axis Grinder[3] | — |
| OEM | — | Disco[4] |
| Model | — | 321[4] |
| Equipment type | — | Wafer Dicing Saw[4] |
| Facility context | — | Cleanroom Instrumentation[4] |
| Application area | — | Nano and Micro Fabrication[4] |
| Location | — | FNT 4.106[4] |
| Wafer Size | — | Up to 6 inches[5] |
| Spindle Power | — | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[6] |
| Spindle Power (alternate) | — | 1500 Watt spindle[5] |
| Non-Contact Setup | — | Non Contact Setup[6] |
| Microscope | — | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[6] |
| Broken Blade Detection | — | Broken Blade Detection[6] |
| Light Tower | — | Includes Light Tower[6] |
| Chuck Type | — | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[5] |
| Wafer size capability | — | Up to 6" wafers[6] |
| Chuck | — | 6-inch porous film frame chuck[5] |
| Spindle power | — | 1500-watt spindle[5] |
| Footprint | — | Small footprint[5] |
| Setup | — | Non-contact setup[6] |
| Blade break detection | — | Broken blade detection[6] |
| Other features | — | Floppy drive, light tower, blade tools, manuals[6] |
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