Comparison ledger
Accretech HRG 200 X, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HRG 200 XAccretech | 20 36 SurfaceBlanchard |
|---|---|---|
| OEM | Accretech | Blanchard |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech HRG 200 | Blanchard 20 36 Surface |
| Specifications | ||
| Grinding Wheel Diameter | 250 mm[1] | — |
| Grinding Wheel Spindle Speed | Max. 3600 rmp[1] | — |
| Working Spindle Speed | 800 rpm[1] | — |
| Motor Power | 6.3 KW[1] | — |
| Wafer Sizes | 2, 3, 4, 5, 6, 8 inch[1] | — |
| Wafer Size Range | 2-inch to 8-inch wafers[2] | — |
| Machine Type | Fully Automatic High Rigid 2-Axis Grinder[3] | — |
| Configuration | — | With new Elecro-Matic Neutrol II Magnetic Chuck Control[4] |
| Magnetic Chuck Control | — | Electro-Matic Neutrol II[4] |
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