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Comparison ledger

HRG 200 Xversus18 D Surface

Accretech HRG 200 X, Blanchard 18 D Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
HRG 200 XAccretech
18 D SurfaceBlanchard
OEMAccretechBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech HRG 200Blanchard 18 D Surface
Specifications
Grinding Wheel Diameter250 mm[1]—
Grinding Wheel Spindle SpeedMax. 3600 rmp[1]—
Working Spindle Speed800 rpm[1]—
Motor Power6.3 KW[1]—
Wafer Sizes2, 3, 4, 5, 6, 8 inch[1]—
Wafer Size Range2-inch to 8-inch wafers[2]—
Machine TypeFully Automatic High Rigid 2-Axis Grinder[3]—
Voltage—416 V[4]
Phase—3 Phase[4]
Cycles—50[4]
Control Voltage—110[4]
Make—Blanchard[4]
Model—18 D[4]
Asset #—153970[4]
Power—416 V, 3 phase[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]accretech.comaccretech.com
  4. [4]inventory listing
  5. [5]Equipment inventory listing