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-407B-2-S-CE-S293 RobotversusScientific FEI Helios NanoLab 600 FIB

ABM -407B-2-S-CE-S293 Robot, Thermo Fisher Scientific FEI Helios NanoLab 600 FIB, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMABMThermo Fisher
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FamilyABM -407B-2-S-CE-S293 RobotThermo Fisher Scientific FEI Helios NanoLab 600 FIB
Specifications
ModelABM-407B-2-S-CE-S293[1]—
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Configuration—Dual beam[2]
Sample stage—5-Axes motorized X-Y-Z-rotate-tilt stage[2]
Step size—100 nm (Minimum)[2]
High vacuum—10^-10 mbar[2]
X, Y-Axis—150 mm[2]
Z-Axis—10 mm[2]
Tilt range—-5° to +60°[2]
Source—SCHOTTKY Field emitter[2]
Accelerating voltage—350 V to 30 kV (Continuously adjustable)[2]
Beam current—1 pA - 22 nA[2]
Type—Dual beam[2]
Vacuum system—Edwards XDS10 Scroll pump[2]
Travel X, Y-Axis—150 mm[2]
Travel Z-Axis—10 mm[2]
Repeatability—1 µm at 0°; 2 µ at 52°[2]
Electron source—SCHOTTKY Field emitter[2]
Electron accelerating voltage—350 V to 30 kV (Continuously adjustable)[2]
Electron beam current—1 pA - 22 nA[2]
Electron resolution—0.9 nm at 15 kV; 1.4 nm at 1 kV[2]
Ion source—Liquid Gallium ion emitter[2]
Ion optics—Sidewinder Field emission focused ion beam optics[2]
Ion accelerating voltage—0.5 kV to 30 kV (Continuously adjustable)[2]
Ion beam current—1.5 pA - 20 nA[2]
Ion imaging resolution—5 nm at 30 kV[2]
Ion milling resolution—10 nn on Cr thin film[2]
Scanner resolutions—512x442, 1024x884, 2048x1768, 4096x3536 pixels[2]
Minimum dwell time—25 ns/pixel[2]
Patterning maximum resolution—64k x 64k[2]
Patterning maximum dwell—25 ms/pixel[2]
Detectors—In-lens SE and BSE True Lens Detector (TLD); Everhart-Thornely SE Detector (ETD); 14-Segments solid state STEM II detector; Chamber viewing IR CCD camera[2]
Controller—Microscope controller; LCD Monitor, 19"; Screen resolution 1280x1024; Optical mouse; Chamber door mounted interface for manipulators[2]
Imaging resolution—5 nm at 30 kV[2]
Milling resolution—10 nn on Cr thin film[2]
Resolution—512x442, 1024x884, 2048x1768, 4096x3536 pixels[2]
Maximum resolution—64k x 64k[2]
Minimum dwell—25 ns/pixel[2]
Maximum dwell—25 ms/pixel[2]
Screen resolution—1280x1024[2]
Instrument type—Dual beam focused ion beam (FIB)[2]
Stage—5-axis motorized X-Y-Z-rotate-tilt stage[2]
Stage travel X/Y—150 mm[4]
Stage travel Z—10 mm[2]
Vacuum pump—Edwards XDS10 scroll pump[2]
Sample stage step size—100 nm minimum[2]
Maximum dwell time—25 ms/pixel[2]
Additional included item—Broad beam plasma source ion column (focus 250 µm)[2]
Included documentation—Manuals included[2]
Manipulator—Does not include manipulator[2]
Stage control—5 axes motorized XYZRT 6 in UHR stage with piezo control[4]
Magnification—69x to 2,300,000x[4]
Detector—Through-lens detection for SE and BSE[4]
STEM detector—Retractable[4]
Stage tilt—-10° to +60°[4]
Optional accessories—Omniprobe Autoprobe 200; Ibss Group GV10x plasma cleaner[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]waferpedia.comwaferpedia.com