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-407B-2-S-CE-S293 RobotversusNanospec 210

ABM -407B-2-S-CE-S293 Robot, Onto Innovation Nanospec 210, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Nanospec 210Onto Innovation
OEMABMOnto Innovation
Category——
Wafer size——
Process node——
Introduced——
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FamilyABM -407B-2-S-CE-S293 RobotOnto Innovation Nanospec 210
Specifications
ModelABM-407B-2-S-CE-S293[1]Nanospec 210[4]
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Thickness Range—100 to 500,000 angstroms[2]
Typical Measurement Time—2.5 seconds[2]
Spot Size (5x objective)—50 µm[2]
Spot Size (10x objective)—25 µm[2]
Spot Size (40x objective)—6.5 µm[2]
Resolution—100 angstroms[3]
Reproducibility—5Å ±5% depending on film type[2]
Film Types Measured—Oxide on Silicon, Nitride on Silicon, Negative Resist on Silicon, Polysilicon on Oxide, Negative Resist on Oxide, Nitride on Oxide, Polyimide on Silicon, Positive Resist on Silicon, Positive Resist on Oxide[2]
Reflectance Mode—Thick Films[2]
Manufacturer—Onto Innovation (formerly Nanometrics)[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]tech-semi.comtech-semi.com
  3. [3]jmind.comjmind.com
  4. [4]Equipment inventory listing