Comparison ledger
ABM -407B-1-S-CES293 Robot, Panasonic NPM D 3 Electronic Production Modular, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ABM | Panasonic |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | — |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Machine type | — | Modular SMT placement machine / chip mounter[1] |
| OEM | — | Panasonic[3] |
| Model designation | — | NPM D 3 / NPM-D3[3] |
| Architecture | — | Compact, dual-beam head with reinforced frame[1] |
| PCB size (double-lane) | — | L50×W50 to L510×W300 mm[1] |
| PCB size (single-lane) | — | L50×W50 to L510×W590 mm[1] |
| Placement accuracy (H16 head) | — | ±0.04 mm (Cpk≥1); ±0.03 mm for 0402, 0603, 1005 placement[1] |
| Placement accuracy (H12/H08 heads) | — | ±0.03 mm for 0402, 0603, 1005 placement (Cpk≥1)[1] |
| Capacity (H16 head) | — | 84,000 CPH (chip: 0.043 s/chip); 76,000 CPH (chip: 0.047 s/chip)[1] |
| Capacity (H12 head) | — | 69,000 CPH (chip: 0.052 s/chip)[1] |
| Capacity (H08 head) | — | 43,000 CPH (chip: 0.084 s/chip)[1] |
| Capacity (H02 head) | — | 11,000 CPH (chip: 0.327 s/chip); 8,500 CPH (QFP: 0.423 s/chip)[1] |
| Placeable component size (H16 head) | — | 03015 to 6×6 mm; height max 3.0 mm[1] |
| Placeable component size (H12 head) | — | 0402 to 12×12 mm; height max 6.5 mm[1] |
| Placeable component size (H08 head) | — | 0402 to 32×32 mm; height max 12 mm[1] |
| Placeable component size (H02 head) | — | 0603 to 100×90 mm; height max 28 mm[1] |
| Machine size | — | W 832 × D 2,683 × H 1,444 mm (when connected to a tray feeder)[1] |
| Machine weight | — | Main body 1,680 kg; tray feeder 200 kg; exchange trolley 110 kg; check BOX 70 kg[1] |
| Multi-recognition camera | — | Field-scalable multi-recognition camera combining alignment, thickness and 3D coplanarity in one step[1] |
| Board handling | — | Flexible board handling system supporting single and multiple dual-lane operation modes[1] |
| Throughput improvement | — | IPC-9850 throughput boosted 30% to 38,078 CPH per square meter; placement accuracy improved by 25%[1] |
| Footprint and operation | — | Compact footprint and dual-side operation maximize factory floor space utilization and scalability[1] |